电子研发工程师英文简历表格

时间:2021-08-31

电子研发工程师英文简历表格

  一份好的简历不仅有主题突出的经历,而且有特点的包装和格式是吸引注用人单位人事经理的主要方面之一。如果使用各种字体格式,如斜体、大写、下划线、首字突出、首行缩进或尖头等等方式,有重点有节奏地表达思想。有些求职者以为另类的简历会让人耳目一新,所以往往追求新、奇的.特色。除非是你寻求的职位有些别样,最好是在简洁、醒目上下功夫,不要过于花哨,否则适得其反。

  下面是yjbys小编和大家分享的电子研发工程师英文简历表格,更多内容请关注(www.010zaixian.com/jianli)。

Name: yjbysHukou:Shanghai
Residency:ShanghaiWork Experience: 
Current Salary: Tel: 
E-mail:www.010zaixian.com/jianli
Career Objective
Desired Industry:Electronics/Semiconductor/IC ,Science/Research ,Government ,Others ,Testing, Certification
Desired Position:Senior Hardware Engineer ,Semiconductor Technology, Branch Office Manager ,Chief Representative ,Research Specialist Staff
Desired address:Shanghai ,Hongkong ,Beijing ,Taiwan ,MacaoDesired Salary:Negotiable
 Work Experience
20xx/06—Present***Company
 Industry: Electronics/Semiconductor/IC
Intel Flash Engineering Department Individual Contributor
Responsibilities:
I have been working in Intel Flash Assembly & Test Engineering
Department as an Individual Contributor since June of 20xx.
Being Leader of ATE Yield team, I have been working with the team members to improve the products yield. Our efforts are paid off:
  1. The yield of year 20xx has been dramatically increased than that of year 20xx.
  2. The yield of all products, consecutively meets the goal.
  3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 20xx. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 20xx.
Report Directly to: Department ManagerNumber of Subordinate: 14
Reference: Bao Powel
Achievements: Being Leader of ATE Yield team, I have been working with the team members to improve the products yield.
Our efforts are paid off:
  1. The yield of year 20xx has been dramatically increased than that of year 20xx.
  2. The yield of all products, consecutively meets the goal.
  3. The total amount of cost saving due to yield improvement is more than $1 million compared with year 20xx. Being the Leader of Board Repair Team in ATE, I worked with my team members, setup a set of new procedure to replace the current one, I defined the schedule, divided the roles & responsibilities among team members, follow up the progress. Finally, the team has made a great cost saving of $2.5M in 20xx.
20xx/01—20xx/05Intel(Shanghai) Technology Development Ltd. Company
 Industry: Electronics/Semiconductor/IC
Intel STTD-China Department Electronics Development Engineer
Responsibilities:
  1. I had been working in STTD-China since Jan 20xx to May 20xx as a senior module engineer.
  2. At that time, as a main contributor of this project, we succeeded in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one time.
Report Directly to: Hopman Mark   Number of Subordinate: 14
Reference: Bao Powel
Reason for Leaving: I was transferred to Intel(Shanghai)Products Ltd. Company due to the internal re-organization in June of 20xx.
Achievements: As a main contributor of STTD-China department, I co-work with my colleagues to succeed in developing a set of MASSIVELY PARALLEL CLASS TEST equipment, which is able to test more than 6700 units in one cycle.
20xx/05—20xx/01Nanyang University of Science & Technology
 Industry: Electronics/Semiconductor/IC
Electronics & Electrical Engineering Department Research Fellow
Responsibilities:
  1. I work in Electronics & Electrical Engineering Department of Nanyang University of Science & Technology as a Research Fellow.
  2. I majored at Gate Oxide Reliability Research in the duration.
Report Directly to: Professor Pey Kin Leoh 
Subordinate: 3
Reference: Patrick Low
Reason for Leaving: I completed the project which I undertook by myself, and want to do more challenging job.
Achievements: In less than one year, I made a lot of experiments and acquired the wonderful data for the project by myself.
Project Experience
20xx/01—PresentAssembly NPI (New Product Introduction)
 Project Description: To introduce more products into Intel Flash Assembly factory, I join Assembly NPI team and work as the team leader. I coordinate with IE, Planner, Marketing guy and Engineer to select new product items, do demo in factory, and then qualify it.
Responsibility: I am working as NPI Team leader and coordinate all team members, define the NPI candidate, make Assembly build plan, follow up the progress.
20xx/01—20xx/12Marginal Electrical Boards Rescue
 Project Description: To rescue some electrical boards of testing equipment, a Task Force team was built up and led by me. We categorized each kind of board, made historical failure analysis on each kind of board and around &2.5 million dollars was saved finally.
Responsibility: Being the team leader, I took the job of data analysis, define each member's role, make program plan, coordinate each team member and follow up the progress.
20xx/10—20xx/05Optimization the current Test Process Order for Flash Memory
 Project Description: To simplify the current Test procedure and enhance the working efficiency, a Task Force team has been called and started by me.
Responsibility: Being the Project leader, I take the main responsibility, such as, design, plan, organize and implement.
20xx/05—20xx/12Test Yield of Flash memory Improvement
 Project Description: To improve the test yield of different products, a Task Force team was built up and led by me. Being the team leader, I worked with all team members to dig out the failure root cause for each product, defined action taken plan for each emergency case, coordinated each team member and make pro-active plan to avoided unexpected things happen.
Responsibility: Being the team leader of Improving Test Yield, coordinate each team member, make program plan and follow up.
Education and Training
20xx/05—20xx/01Nanyang University of Science & Technology Microelectronics Doctorate
 I worked in Nan yang University of Science & Technology as a Research Fellow. I major at Gate oxide Reliability research in the duration.
20xx/03—20xx/03Seoul National University of Korea Microelectronics Others
 I had been working in National Physical Lab of Seoul National University in Korea since March of 20xx to March of 20xx as a Post-doctor. Where I unhook the project of research & development of Carbon-Nan tube Biosensor. And only after one year, an EIS sensor based on CMOS technology has been successfully produced. And one SCI paper about it has been published in Semiconductor Science and Technology.
20xx/03—20xx/03Shanghai Institute of Microsystems and Information Technology,Chinese Academy of Sciences Information Technology Doctorate
20xx/09—20xx/03Nanjing University of Science & Technology Material Science and Engineering Master
 Being a master student of this period, I have published one EI paper about Super-fine metal power's electrical characteristics.
20xx/09—20xx/07Nanjing University of Science & Technology Material Science and Engineering Bachelor
20xx/07—20xx/07Assistant Engineer in Quality Verification Department, Boiler Factory in Zhengzhou city of Henan resistant Engineer in Quality Verification Department
Professional Skills
Language Skills:English: EXCELLENT
Korean: AVERAGE
Computer Skills:Technology   skilled 96Month
SAP   understanding 8Month
Certificate:20xx/11  MCSE
20xx/06  CET6
Self-appraisal
7 years working experience of Semiconductor Industry and where 2 years overseas working/study experience. Smart working, innovation thinking and very talented creative working model.

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